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隐藏了，T18高精度芯片贴装机器人
S17（AOI）芯片、镜片分拣检测机器人 S17（AOI）芯片、镜片分拣检测机器人 S17（AOI）芯片、镜片分拣检测机器人

更精准的芯片贴装

更健康的生产管控

更灵活的适应产品切换

 

 

产品参数

T18

型号
Model
T18
T18Plus
T18Pro
放置精度
Placement accuracy
±10μm@3σ
±7μm@3σ
±3μm@3σ
放置角度
Placement angle
±1°
±0.5°
±0.1°
晶圆台(晶圆）
Wafer table (wafer)
MAX.8吋
MAX.8吋
MAX.8吋
工作台尺寸
Working desk size
MAX:120*180mm
适应物料托盘尺寸(有效工作行程）
Adapt to the size of the material tray (effective working stroke)
MAX:120*180mm
适应物料托盘尺寸(有效工作行程）
Adapt to the size of the material tray (effective working stroke)
MAX:120*180mm
适应物料托盘尺寸(有效工作行程）
Adapt to the size of the material tray (effective working stroke)
芯片尺寸
Chip size
0.25mm~8mm厚度thickness≥120um
0.18mm~16mm 厚度thickness≥70um
0.18mm~16mm厚度 thickness≥70um
外形尺寸、重量
Size, weigh
1600x1300 x 1950 mm
≈2800Kg
不包含上下料
Does not include loading and unloading
1600x1300 x 1950 mm
≈2800Kg
不包含上下料
Does not include loading and unloading
1600x1300 x 1950 mm
≈2800Kg
不包含上下料
Does not include loading and unloading
拾取力控制
Picking force control
自动音圈控力Automatic voice coil control
可控范围：20～300g
Controllable range：20～300g
自动音圈控力Automatic voice coil control
可控范围：20～300g
Controllable range：20～300g
自动音圈控力Automatic voice coil control
可控范围：20～300g
Controllable range：20～300g
产能
Production capacity(UPH)
MAX.1600pcs/hr
（根据治具矩阵密集程度计数）
Count according to the density of the fixture matrix
MAX.1300pcs/hr
（根据治具矩阵密集程度计数）
Count according to the density of the fixture matrix
MAX.1000pcs/hr
（根据治具矩阵密集程度计数）
Count according to the density of the fixture matrix
检测功能
Detection function
芯片墨点识别、芯片缺损相似度识别
Chip dot recognition, chip defect similarity recognition
芯片墨点识别、芯片缺损相似度识别
Chip dot recognition, chip defect similarity recognition
芯片墨点识别、芯片缺损相似度识别
Chip dot recognition, chip defect similarity recognition
健康功能
Health function
去离子装置、操作窗口光幕
Deionization device, operating window light curtain
去离子装置、操作窗口光幕
Deionization device, operating window
light curtain
去离子装置、操作窗口光幕
Deionization device, operating window
light curtain 
智能权限
Intelligent authority
作业员/工程师操作权限、
Mapping地图读取、生成（选配）
Operator/engineer operation authority,
Mapping map reading, generation (optional)
作业员/工程师操作权限、
Mapping地图读取、生成（选配）
Operator/engineer operation authority,
Mapping map reading, generation (optional)
作业员/工程师操作权限、
Mapping地图读取、生成（选配）
Operator/engineer operation authority,
Mapping map reading, generation (optional)
可选组合：
Optional combination: 
1、Wafer 晶圆台尺寸：MAX.8 吋晶圆（子母或铁环）、4 吋芯片盒、2 吋芯片盒
Wafer  table size: MAX. 8-inch wafer (Plastic ring or iron ring), 4-inch chip box, 2-inch chip box
2、工作台兼容：2吋芯片盒、4 吋芯片盒、MAX.6吋铁环、MAX.10吋子母环、定制治具
Workbench compatible: 2 inch chip box, 4 inch chip box, MAX.6 inch iron ring, MAX.10 inch daughter and mother ring, custom fixture
3、自动上下料尺寸：上下合计宽度：1000mm
Automatic loading and unloading size: total width up and down: 1000mm
4、可定制AOI功能
Customizable AOI function

 

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