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更精确的亚像素级芯片辨识率 |
更健康的生产管控 |
更灵活的适应产品 |
产品参数
M18
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型号
Model |
M18
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M18plus
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M18pro
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放置精度
Placement accuracy |
±15μm@3σ
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±25μm@3σ
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±10μm@3σ
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放置角度
Placement angle |
±1.5°
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±2°
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±1°
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晶圆台(晶圆）
Wafer table (wafer) |
MAX.8吋
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MAX.8吋
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MAX.8吋
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芯片尺寸
Chip size, |
0.18mm~16mm
厚度thickness≥70um |
0.18mm~16mm
厚度thickness≥70um |
0.18mm~16mm
厚度thickness≥70um |
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外形尺寸、重量
Size, weigh |
≈1300x 1650 x 1800 mm
≈2000Kg |
≈1300x 1650 x 1800 mm
≈2000Kg （不包含自动换料换Wafer机构） (Excluding Wafer mechanism for automatic material change) |
≈1300x 1650 x 1800 mm
≈2000Kg （不包含自动换料换Wafer机构） (Excluding Wafer mechanism for automatic material change) |
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焊头功能
Weld head function |
点、画胶，单、双吸头
Dot glue, double suction head |
点、画胶，单、双吸头
Dot glue, double suction head |
点、画胶，单、双吸头
Dot glue, double suction head |
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拾取力控制
Picking force control |
自动音圈控力
可控范围：10～300g Controllable range |
自动音圈控力
可控范围：20～300g Controllable range |
自动音圈控力
可控范围：10～300g Controllable range |
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上下料功能
Loading and unloading function |
手动上下料（950mm)
Manual loading and unloading |
独立上下料机构/轨道接驳（950mm)（LU）
Independent loading and unloading mechanism / track connection（950mm） |
独立上下料机构/cast/轨道接驳（950mm)（LU）
Independent loading and unloading mechanism / track connection（950mm） |
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工作台宽度
Worktable width Track |
MAX.500*350mm
适应物料托盘尺寸 Adapt to the size of the material tray |
MAX.500*350mm
适应物料托盘尺寸 Adapt to the size of the material tray |
MAX.500*350mm
适应物料托盘尺寸 Adapt to the size of the material tray |
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产能
Production capacity(UPH) |
MAX.3000pcs/hr
（根据治具矩阵密集程度计数） Count according to the density of the fixture matrix |
MAX.4000Kpcs/hr
（根据治具矩阵密集程度计数） Count according to the density of the fixture matrix |
MMAX.4000Kpcs/hr
（ 根据治具矩阵密集程度计数） Count according to the density of the fixture matrix |
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检测功能
Detection function |
芯片墨点识别、芯片缺损相似度识别
Chip dot recognition, chip defect similarity recognition |
芯片墨点识别、芯片缺损相似度识别
Chip dot recognition, chip defect similarity recognition |
芯片墨点识别、芯片缺损相似度识别
Chip dot recognition, chip defect similarity recognition |
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底部视觉检测
Bottom visual inspection |
/ Nonfunctional
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/Nonfunctional
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标配
Standard |
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健康功能
Health function |
去离子装置、操作窗口光幕
Deionization device, operating window light curtain (optional) |
去离子装置、操作窗口光幕
Deionization device, operating window light curtain (optional) |
去离子装置、操作窗口光幕
Deionization device, operating window light curtain (optional) |
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智能权限
Intelligent authority |
作业员/工程师操作权限、
Mapping地图读取（选配） Operator/engineer operation authority, Mappingreading (optional) |
作业员/工程师操作权限、
Mapping地图读取（选配） Operator/engineer operation authority, Mappingreading (optional) |
作业员/工程师操作权限、
Mapping地图读取（选配） Operator/engineer operation authority, Mappingreading (optional) |
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可选组合：
Optional combination: |
1、Wafer 晶圆台尺寸：MAX.8 吋晶圆（子母或铁环）
1Wafer wafer table size: MAX.8 inch wafer (Plastic ring or iron ring) 2、工作台尺寸：4 吋芯片盒、2 吋芯片盒、定制治具 Workbench size: 4 inch chip box, 2 inch chip box, custom fixture 3.CASET、底部识别 CASET, bottom recognition 4、自动上下料机构：按材料托盘350*500，单个机构尺寸：700*900mm,重量：300KG Automatic loading and unloading mechanism: according to material tray 350 * 500, single mechanism size: 700 * 900mm, weight: 300KG 5、自动换Wafer机构：按8吋晶圆铁环，尺寸：350*350mm,重量：50KG Automatic Wafer mechanism change: press 8 inch wafer iron ring, size: 350 * 350mm, weight: 50KG |
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